Welcome!

News Feed Item

Flip-Chip Technologies and Global Markets

LONDON, Sept. 1, 2014 /PRNewswire/ -- Reportbuyer.com has added a new market research report:

Flip-Chip Technologies and Global Markets

https://www.reportbuyer.com/product/1941933/Flip-Chip-Technologies-and-Global-Markets.html

INTRODUCTION

Flip chip technology has enabled electronics technology to reach new levels of performance, while fueling the growth of global markets for semiconductors, electronic devices and a host of industrial and consumer products.
This market research report examines, quantifies and forecasts the growth of flip chip technologies and provides guidance to interested parties.

STUDY GOALS AND OBJECTIVES

• Analysis of flip chip technology market trends and dynamics, including the factors currently driving and restraining the growth of the market as well as their impact over the long term.
• Opportunities and innovation-driven flip chip market highlights and the major regions and countries involved in such developments.
• Analysis of the various applications of the flip chip market and market dynamics of each application.
• Identifying segments with high growth prospects with a discussion of future applications within each segment.
• Key trends related to the product, technology, prices and applications that shape and influence the flip chip market.
• Region-specific developments and distinctive characteristics.
• The major stakeholders in the market and the competitive landscape.
• Analysis of the key growth strategies of key players in the flip chip market.
• Patent analysis where relevant.

REASONS FOR DOING THE STUDY

In recent years, the growth of flip chip interconnect technology over other interconnect technologies has been remarkable. This is due to the increasing complexity of the architecture of chip design and fabrication. Increased demand for small-size chips ranging from around 12 mm to 35 mm chipsets has increased the market. This study defines the scope of flip chips with a segmental analysis such as by application and end user, helping the reader gain knowledge about technological as well as analytical aspects of the industry.

SCOPE OF REPORT

The market for flip chip technology is segmented into following categories:
• Wafer bumping process:
o Copper (Cu) pillar.
o Lead (Pb)-free solder.
o Tin-lead (Sn-Pb) eutectic solder.
o Gold stud + plated solder.
• Application area:
o 2D logic system-on-a-chip (SoC)
o Memory
o Imaging, high-brightness light-emitting diode (HB-LED) small logic
o RF, power, analog and mixed signal ICs.
o µ-bumping for 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC).
• End use:
o Smartphones.
o Laptops.
o Desktop CPUs.
o GPUs and chipsets.
o Other computing devices.
o Automotive.
o Robotics.
o Medical devices.
o Smart technologies.
o High-performance/industrial applications.
• Geographical regions:
o North America (the U.S., Canada and Mexico)
o Europe (Italy, France, Germany, U.K. and other countries).
o Asia-Pacific (China, Japan, Taiwan, South Korea, India and other countries).
o ROW (Middle East and Africa).

This report also provides a competitive analysis of the industry, a patent analysis and a chapter including company profiles.

INTENDED AUDIENCE

• Manufacturers.
• End-user companies.
• Foundries.
• Researchers.
• Raw material providers.
• Players involve in testing phase.
• Investors (private equity, venture capital, etc.).

INFORMATION SOURCES

BCC Research conducted primary and secondary research to develop this report including:
• Primary sources:
o Selected experts from related industries.
o Preferred suppliers.
• Secondary sources:
o E-magazines.
o Directories.
o Databases such as OneSource, Factiva, Bloomberg, SEC filings Reuters.
o Stock exchanges such as TMX, NASDAQ, ASX and LSE.

ANALYST CREDENTIALS

Gaurav Bhushan holds an MBA in Finance from ICFAI Business School, Hyderabad (India) and a Bachelor's degree in Electrical Engineering from Rajasthan University (India). He focuses on client information requests within the electronics and semiconductor market, helping them to understand the market. He has close to four years of experience in the field of market research in electronics, financials and database design. His areas of interest include semiconductors, automation, industrial controls, recent technologies, robotics and nanotechnology. He has published works on quantum dots, big data, ultracapacitors, home automation, HMDs, factory automation, and the RF components market.

REPORT HIGHLIGHTS

The global market for Flip Chip Technology by wafer bumping process reached $18.9 billion in 2012. This market is expected to grow to $20.1 billion in 2013 and $36.5 billion in 2018, a compound annual growth rate (CAGR) of 12.7% over the five-year period from 2013 to 2018.
This report provides:
• An overview of the global market for flip-chip technologies, a process to interconnect IC's and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.
• Analyses of global market trends, with data from 2012, estimates for 2013, and projections of compound annual growth rates (CAGRs) for the period, 2013 to 2018.
• Discussion of the evolution, architecture, and value chain of flip-chip technologies.
• Examination of market dynamics, including drivers, restraints, and opportunities.
• Analysis of the flip-chip assembly market by geography, including North America, Europe, Asia-Pacific, and others.
• Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.
• Comprehensive company profiles of major players.

TABLE OF CONTENTS

CHAPTER 1 INTRODUCTION 2

STUDY GOALS AND OBJECTIVES 2
REASONS FOR DOING THE STUDY 2
SCOPE OF REPORT 2
INTENDED AUDIENCE 3
INFORMATION SOURCES 3
ANALYST CREDENTIALS 4
RELATED BCC RESEARCH REPORTS 4
BCC RESEARCH ONLINE SERVICES 4
DISCLAIMER 4

CHAPTER 2 SUMMARY 6

SUMMARY TABLE GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, THROUGH 2018 ($ MILLIONS) 7
SUMMARY FIGURE GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, THROUGH 2018 ($ MILLIONS) 7

CHAPTER 3 OVERVIEW 9

MARKET DEFINITION 9
EVOLUTION OF FLIP CHIP WAFER BUMPING TECHNOLOGIES 9
FIGURE 1 DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004 9
SOLDER EVAPORATION 9
FIGURE 2 SOLDER EVAPORATION PROCESS 10
ELECTROPLATING OF SOLDER ALLOYS 10
FIGURE 3 SOLDER ALLOY ELECTROPLATING PROCESS 10
SOLDER PASTE SCREENING 11
FIGURE 4 SOLDER PASTE SCREENING PROCESS 11
SOLDER BALL REPLACEMENT 12
C4NP PROCESS 12
VALUE CHAIN ANALYSIS 13
FIGURE 5 VALUE CHAIN OF FLIP CHIP TECHNOLOGY INDUSTRY 13
SUPPLY CHAIN ANALYSIS 14
FIGURE 6 FLIP CHIP INDUSTRY SUPPLY CHAIN 14

CHAPTER 4 FLIP CHIP TECHNOLOGY MARKET BY WAFER BUMPING PROCESS 17

INTRODUCTION 17
FIGURE 7 GLOBAL FLIP CHIP TECHNOLOGY MARKET SHARES BY WAFER BUMPING
PROCESS, 2012 AND 2018 (%) 17
TABLE 1 GLOBAL FLIP CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH
2018 (UNITS) 18
FIGURE 8 GLOBAL FLIP CHIP TECHNOLOGY MARKET SHARES OF UNIT SHIPMENTS
BY WAFER BUMPING PROCESS, 2012 AND 2018 (%) 18
TABLE 2 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY MARKET BASED ON THE
AVERAGE PRICE PER UNIT OF THE WAFER BUMPING PROCESS, THROUGH 2018 ($
MILLIONS)
19
MARKET DYNAMICS 19
Drivers 19
Introduction of New Metals and Processes in Flip Chips 19
Consumer End-User Demand 20
Restraints 20
Government Rules and Regulations 20
European Union 20
High Investment Cost 21
Current Solder Bumps Still Have Structural Problems 21
CU PILLAR 21
TABLE 3 GLOBAL MARKET FOR CU PILLAR FLIP CHIPS BY END USE, THROUGH 2018
($ MILLIONS) 22
FIGURE 9 Y-O-Y GROWTH IN DOLLAR AND UNIT SALES OF CU PILLAR FLIP CHIPS,
THROUGH 2018 (%) 22
CU BUMPING FEATURES 23
SIGNIFICANT PATENTS ON CU PILLAR FLIP CHIP TECHNOLOGIES 24
SN-PB EUTECTIC SOLDER 25
TABLE 4 MECHANICAL PROPERTIES OF SN-PB 26
TABLE 5 PHYSICAL PROPERTIES OF SN-PB 26
TABLE 6 GLOBAL MARKET FOR SN-PB FLIP CHIPS BY END USE, THROUGH 2018 ($
MILLIONS) 27
FIGURE 10 Y-O-Y GROWTH IN DOLLAR AND UNIT SALES OF SN-PB FLIP CHIPS,
THROUGH 2018 (%) 27
ADVANTAGES OF SN-PB EUTECTIC SOLDER 28
DISADVANTAGES OF SN-PB EUTECTIC SOLDER 28
SIGNIFICANT PATENTS ON SN-PB SOLDER TECHNOLOGIES 28
LEAD-FREE SOLDER 29
TABLE 7 CHARACTERISTICS OF VARIOUS ELEMENTS 30
TABLE 8 CHARACTERISTIC OF VARIOUS MIXED COMPOSITIONS 30
PROPERTIES OF SOME COMMONLY USED ALLOY SYSTEMS 31
58Bi-42Sn 31
52In-48Sn 32
MARKET SNAPSHOT 32
TABLE 9 GLOBAL MARKET FOR PB-FREE FLIP CHIPS BY END USE, THROUGH 2018
($ MILLIONS) 32
FIGURE 11 Y-O-Y GROWTH IN DOLLAR AND VOLUME SALES OF LEAD-FREE FLIP
CHIPS, 2013-2018 (%) 33
SIGNIFICANT PATENTS ON LEAD-FREE FLIP CHIP TECHNOLOGIES 33
GOLD STUD BUMPING 35
MARKET SNAPSHOT 36
TABLE 10 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE,
THROUGH 2018 ($ MILLIONS) 36
FIGURE 12 Y-O-Y GROWTH IN DOLLAR AND VOLUME SALES OF GOLD STUD
BUMPED FLIP CHIPS, THROUGH 2018 (%) 36
SIGNIFICANT PATENTS ON GOLD STUD BUMPING TECHNOLOGIES 37

CHAPTER 5 FLIP CHIP TECHNOLOGY MARKET BY APPLICATION 40

INTRODUCTION 40
FIGURE 13 MARKET SEGMENTATION BY APPLICATION 40
TABLE 11 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGIES BY APPLICATION,
THROUGH 2018 ($ MILLIONS) 41
FIGURE 14 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGIES BY APPLICATION,
2012- 2018 ($ MILLIONS) 41
MARKET DYNAMICS 42
Drivers 42
Development of 3D ICs 42
Double Data Rate Fourth-Generation (DDR4) Memory 42
Restraints 42
2D LOGIC SOC 42
FIGURE 15 STRUCTURE OF MULTI-CHIP MODULE 43
FIGURE 16 STRUCTURE OF SYSTEM ON CHIP 43
TABLE 12 GLOBAL MARKET FOR FLIP CHIPS USED IN 2D LOGIC SOC APPLICATIONS
BY REGION, THROUGH 2018 ($ MILLIONS) 45
MEMORY 45
TABLE 13 COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY 45
TABLE 14 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY
REGION, THROUGH 2018 ($ MILLIONS) 47
FIGURE 17 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN MEMORY
APPLICATIONS, THROUGH 2018 ($ MILLIONS, %) 47
IMAGING 48
TABLE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY
REGION, THROUGH 2018 ($ MILLIONS) 49
FIGURE 18 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN IMAGING
TECHNOLOGIES, 2012–2018 ($ MILLIONS, %) 50
HIGH-BRIGHTNESS LIGHT-EMITTING DIODE (HB LED) 50
FIGURE 19 STRUCTURE OF HB LED 50
TABLE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY
REGION, THROUGH 2018 ($ MILLIONS) 51
FIGURE 20 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN HB-LED
APPLICATIONS, 2012–2018 ($ MILLIONS, %) 52
SMALL LOGIC, RF, POWER, ANALOG ICS 52
TABLE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION,
THROUGH 2018 ($ MILLIONS) 53
FIGURE 21 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN RF
APPLICATIONS, 2012–2018 ($ BILLIONS) 53
2.5D AND 3D SIP/SOC 54
FIGURE 22 ARCHITECTURE OF 2.5D IC 54
FIGURE 23 STRUCTURE OF 3D IC 54
TABLE 18 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5D/3D APPLICATIONS BY
REGION, THROUGH 2018 ($ MILLIONS) 55

CHAPTER 6 FLIP CHIP TECHNOLOGY MARKET BY END USE 57

INTRODUCTION 57
MARKET OVERVIEW 57
TABLE 19 GLOBAL FLIP CHIP MARKET BY END USE, THROUGH 2018 ($ MILLIONS) 57
FIGURE 24 GLOBAL FLIP CHIP TECHNOLOGY MARKET BY END USE, 2012-2018 ($
MILLIONS) 58
MARKET DYNAMICS 59
DRIVERS 59
Introduction of Smart Technologies 59
Research and Development Initiatives 59
RESTRAINTS 59
New Innovation Takes Time 59
SMARTPHONES 59
FIGURE 25 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
SMARTPHONES, 2012-2018 ($ BILLIONS) 59
LAPTOPS 60
FIGURE 26 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
LAPTOPS, 2012–2018 ($ MILLIONS, %) 61
DESKTOP CPUS 61
FIGURE 27 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
DESKTOP CPU, 2012–2018 ($ MILLIONS, %) 61
GPU AND CHIPSETS 62
FIGURE 28 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN GPU
AND CHIPSET APPLICATIONS, 2012–2018 ($ MILLIONS, %) 62
THER COMPUTING DEVICES 63
FIGURE 29 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
OTHER COMPUTING DEVICES, 2012–2018 ($ MILLIONS, %) 63
AUTOMOTIVE 64
FIGURE 30 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
AUTOMOTIVE APPLICATIONS, 2012–2018 ($ MILLIONS, %) 64
ROBOTICS 65
FIGURE 31 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
ROBOTICS, 2012–2018 ($ MILLIONS, %) 66
MEDICAL DEVICES 66
FIGURE 32 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
MEDICAL DEVICES, 2012-2018 ($ MILLIONS, %) 66
SMART TECHNOLOGIES 67
FIGURE 33 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
SMART TECHNOLOGIES, 2012–2018 ($ MILLIONS, %) 67
INDUSTRIAL APPLICATIONS 68
FIGURE 34 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
INDUSTRIAL APPLICATIONS, 2012–2018 ($ MILLIONS, %) 68

CHAPTER 7 FLIP CHIP TECHNOLOGY MARKET BY GEOGRAPHICAL REGION 71

INTRODUCTION 71
FIGURE 35 GEOGRAPHICAL SEGMENTATION OF THE FLIP CHIP MARKET 71
MARKET SNAPSHOT 71
TABLE 20 FLIP CHIP PRODUCTION BY REGION, THROUGH 2018 ($ MILLIONS) 72
TABLE 21 GLOBAL FLIP CHIP MARKET END USE DEMAND BY REGION, THROUGH
2018 ($ MILLIONS) 72
NORTH AMERICA 72
TABLE 22 NORTH AMERICAN FLIP CHIP PRODUCTION BY COUNTRY, THROUGH 2018
($ MILLIONS) 73
TABLE 23 NORTH AMERICAN FLIP CHIP MARKET BY END USE DEMAND AND
COUNTRY, THROUGH 2018 ($ MILLIONS) 73
TABLE 24 NORTH AMERICAN FLIP CHIP MARKET BY END USE DEMAND, THROUGH
2018 ($ MILLIONS) 74
RULES AND REGULATIONS IN NORTH AMERICA 74
EUROPE 75
TABLE 25 EUROPEAN FLIP CHIP PRODUCTION BY COUNTRY, THROUGH 2018 ($
MILLIONS) 75
TABLE 26 EUROPEAN FLIP CHIP MARKET BY END USE DEMAND AND COUNTRY,
THROUGH 2018 ($ MILLIONS) 76
TABLE 27 EUROPEAN FLIP CHIP MARKET BY END USE DEMAND, THROUGH 2018 ($
MILLIONS) 76
RULES AND REGULATIONS IN EUROPE 77
ROHS 77
RoHS 2 77
ASIA-PACIFIC 78
TABLE 28 ASIA-PACIFIC FLIP CHIP MARKET BY PRODUCTION AND COUNTRY,
THROUGH 2018 ($ MILLIONS) 78
TABLE 29 ASIA-PACIFIC FLIP CHIP MARKET BY END USE DEMAND AND COUNTRY,
THROUGH 2018 ($ MILLIONS) 79
TABLE 30 ASIA-PACIFIC FLIP CHIP MARKET BY END USE DEMAND, THROUGH 2018
($ MILLIONS) 79
RULES AND REGULATIONS BY VARIOUS ECONOMIES IN ASIA-PACIFIC 80
China 80
REST OF THE WORLD (ROW) 80
TABLE 31 ROW FLIP CHIP TECHNOLOGY MARKET BY END USE DEMAND, THROUGH
2018 ($ MILLIONS) 80

CHAPTER 8 INDUSTRY STRUCTURE AND COMPETITIVE ANALYSIS 83

INDUSTRY STRUCTURE 83
INFLUENTIAL FACTORS 83
FORECAST COMPONENTS 83
FIGURE 36 INDUSTRY REVENUE MODEL 83
MARKET SHARE ANALYSIS 85
TABLE 32 MARKET SHARE ANALYSIS OF FLIP CHIP MANUFACTURERS, 2012-2013
(%/$ MILLIONS) 85
PORTER FIVE FORCES 86
FIGURE 37 PORTER FIVE FORCES FOR FLIP CHIPS 86
THREAT OF POTENTIAL COMPETITORS 86
THREAT FROM SUBSTITUTES 87
BARGAINING POWER OF SUPPLIER 87
BARGAINING POWER OF BUYER 87
INTENSE COMPETITION 87
PATENT ANALYSIS 87
PATENTS BY REGION 87
FIGURE 38 REGIONAL ANALYSES OF PATENTS, 2010-2013* (NO. OF PATENTS PER
YEAR) 88
PATENTS BY YEAR 88
FIGURE 39 NUMBER OF PATENTS FILED BY YEAR, 2010-2013* 89

CHAPTER 9 COMPANY PROFILES 91

ADVANCED SEMICONDUCTOR ENGINEERING INC. 91
COMPANY OVERVIEW 91
FINANCIAL OVERVIEW 91
FIGURE 40 ADVANCED SEMICONDUCTOR ENGINEERING ANNUAL REVENUE,
2010-2012 ($ BILLIONS) 92
BUSINESS STRATEGIES 92
RECENT DEVELOPMENTS 92
AMKOR TECHNOLOGY INC. 93
COMPANY OVERVIEW 93
FINANCIAL OVERVIEW 93
FIGURE 41 AMKOR TECHNOLOGY INC. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 93
BUSINESS STRATEGIES 94
RECENT DEVELOPMENTS 94
GLOBAL FOUNDRIES U.S. INC. 94
COMPANY OVERVIEW 94
FINANCIAL OVERVIEW 95
FIGURE 42 GLOBAL FOUNDRIES U.S. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 95
BUSINESS STRATEGIES 95
RECENT DEVELOPMENTS 96
IBM CORP. 96
COMPANY OVERVIEW 96
FINANCIAL OVERVIEW 97
FIGURE 43 IBM CORP. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 97
BUSINESS STRATEGIES 97
RECENT DEVELOPMENTS 98
INTEL CORP. 98
COMPANY OVERVIEW 98
FINANCIAL OVERVIEW 99
FIGURE 44 INTEL CORP. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 99
BUSINESS STRATEGIES 99
RECENT DEVELOPMENTS 100
NEPES PTE. LTD. 100
COMPANY OVERVIEW 100
FINANCIAL OVERVIEW 100
FIGURE 45 NEPES PTE LTD. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 100
BUSINESS STRATEGIES 101
RECENT DEVELOPMENTS 101
POWERTECH TECHNOLOGY INC. 101
COMPANY OVERVIEW 102
FINANCIAL OVERVIEW 102
FIGURE 46 POWERTECH TECHNOLOGY INC. ANNUAL REVENUE, 2010-2012 ($
BILLIONS) 102
BUSINESS STRATEGIES 103
RECENT DEVELOPMENTS 103
SAMSUNG ELECTRONICS CO. LTD. 103
COMPANY OVERVIEW 103
FINANCIAL OVERVIEW 104
FIGURE 47 SAMSUNG ELECTRONICS ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 104
BUSINESS STRATEGIES 104
RECENT DEVELOPMENTS 104
SK HYNIX INC. 105
COMPANY OVERVIEW 105
FINANCIAL OVERVIEW 106
FIGURE 48 SK HYNIX INC. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 106
BUSINESS STRATEGIES 106
RECENT DEVELOPMENTS 106
STATS CHIPPAC LTD. 107
COMPANY OVERVIEW 107
FINANCIAL OVERVIEW 107
FIGURE 49 STATS CHIPPAC LTD. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 107
BUSINESS STRATEGIES 108
RECENT DEVELOPMENTS 108
STMICROELECTRONICS NV (STM) 109
COMPANY OVERVIEW 109
FINANCIAL OVERVIEW 109
FIGURE 50 STMICROELECTRONICS NV ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 109
BUSINESS STRATEGIES 110
RECENT DEVELOPMENTS 110
TAIWAN SEMICONDUCTOR MANUFACTURING CO. 111
COMPANY OVERVIEW 111
FINANCIAL OVERVIEW 111
FIGURE 51 TAIWAN SEMICONDUCTOR MANUFACTURING CO. ANNUAL REVENUE,
2010-2012 ($ BILLIONS) 111
BUSINESS STRATEGIES 112
RECENT DEVELOPMENTS 112
TEXAS INSTRUMENTS INC. 113
COMPANY OVERVIEW 113
FINANCIAL OVERVIEW 113
FIGURE 52 TEXAS INSTRUMENTS ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 113
BUSINESS STRATEGIES 114
RECENT DEVELOPMENTS 114

LIST OF TABLES

SUMMARY TABLE GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, THROUGH 2018 ($ MILLIONS) 7
TABLE 1 GLOBAL FLIP CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH
2018 (UNITS) 18
TABLE 2 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY MARKET BASED ON THE
AVERAGE PRICE PER UNIT OF THE WAFER BUMPING PROCESS, THROUGH 2018 ($
MILLIONS)
19
TABLE 3 GLOBAL MARKET FOR CU PILLAR FLIP CHIPS BY END USE, THROUGH 2018
($ MILLIONS) 22
TABLE 4 MECHANICAL PROPERTIES OF SN-PB 26
TABLE 5 PHYSICAL PROPERTIES OF SN-PB 26
TABLE 6 GLOBAL MARKET FOR SN-PB FLIP CHIPS BY END USE, THROUGH 2018 ($
MILLIONS) 27
TABLE 7 CHARACTERISTICS OF VARIOUS ELEMENTS 30
TABLE 8 CHARACTERISTIC OF VARIOUS MIXED COMPOSITIONS 30
TABLE 9 GLOBAL MARKET FOR PB-FREE FLIP CHIPS BY END USE, THROUGH 2018 ($
MILLIONS) 32
TABLE 10 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE,
THROUGH 2018 ($ MILLIONS) 36
TABLE 11 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGIES BY APPLICATION,
THROUGH 2018 ($ MILLIONS) 41
TABLE 12 GLOBAL MARKET FOR FLIP CHIPS USED IN 2D LOGIC SOC APPLICATIONS
BY REGION, THROUGH 2018 ($ MILLIONS) 45
TABLE 13 COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY 45
TABLE 14 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY
REGION, THROUGH 2018 ($ MILLIONS) 47
TABLE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY
REGION, THROUGH 2018 ($ MILLIONS) 49
TABLE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY
REGION, THROUGH 2018 ($ MILLIONS) 51
TABLE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION,
THROUGH 2018 ($ MILLIONS) 53
TABLE 18 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5D/3D APPLICATIONS BY
REGION, THROUGH 2018 ($ MILLIONS) 55
TABLE 19 GLOBAL FLIP CHIP MARKET BY END USE, THROUGH 2018 ($ MILLIONS) 57
TABLE 20 FLIP CHIP PRODUCTION BY REGION, THROUGH 2018 ($ MILLIONS) 72
TABLE 21 GLOBAL FLIP CHIP MARKET END USE DEMAND BY REGION, THROUGH
2018 ($ MILLIONS) 72
TABLE 22 NORTH AMERICAN FLIP CHIP PRODUCTION BY COUNTRY, THROUGH 2018
($ MILLIONS) 73
TABLE 23 NORTH AMERICAN FLIP CHIP MARKET BY END USE DEMAND AND
COUNTRY, THROUGH 2018 ($ MILLIONS) 73
TABLE 24 NORTH AMERICAN FLIP CHIP MARKET BY END USE DEMAND, THROUGH
2018 ($ MILLIONS) 74
TABLE 25 EUROPEAN FLIP CHIP PRODUCTION BY COUNTRY, THROUGH 2018 ($
MILLIONS) 75
TABLE 26 EUROPEAN FLIP CHIP MARKET BY END USE DEMAND AND COUNTRY,
THROUGH 2018 ($ MILLIONS) 76
TABLE 27 EUROPEAN FLIP CHIP MARKET BY END USE DEMAND, THROUGH 2018 ($
MILLIONS) 76
TABLE 28 ASIA-PACIFIC FLIP CHIP MARKET BY PRODUCTION AND COUNTRY,
THROUGH 2018 ($ MILLIONS) 78
TABLE 29 ASIA-PACIFIC FLIP CHIP MARKET BY END USE DEMAND AND COUNTRY,
THROUGH 2018 ($ MILLIONS) 79
TABLE 30 ASIA-PACIFIC FLIP CHIP MARKET BY END USE DEMAND, THROUGH 2018 ($
MILLIONS) 79
TABLE 31 ROW FLIP CHIP TECHNOLOGY MARKET BY END USE DEMAND, THROUGH
2018 ($ MILLIONS) 80
TABLE 32 MARKET SHARE ANALYSIS OF FLIP CHIP MANUFACTURERS, 2012-2013
(%/$ MILLIONS) 85

LIST OF FIGURES

SUMMARY FIGURE GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, THROUGH 2018 ($ MILLIONS) 7
FIGURE 1 DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004 9
FIGURE 2 SOLDER EVAPORATION PROCESS 10
FIGURE 3 SOLDER ALLOY ELECTROPLATING PROCESS 10
FIGURE 4 SOLDER PASTE SCREENING PROCESS 11
FIGURE 5 VALUE CHAIN OF FLIP CHIP TECHNOLOGY INDUSTRY 13
FIGURE 6 FLIP CHIP INDUSTRY SUPPLY CHAIN 14
FIGURE 7 GLOBAL FLIP CHIP TECHNOLOGY MARKET SHARES BY WAFER BUMPING
PROCESS, 2012 AND 2018 (%) 17
FIGURE 8 GLOBAL FLIP CHIP TECHNOLOGY MARKET SHARES OF UNIT SHIPMENTS BY
WAFER BUMPING PROCESS, 2012 AND 2018 (%) 18
FIGURE 9 Y-O-Y GROWTH IN DOLLAR AND UNIT SALES OF CU PILLAR FLIP CHIPS,
THROUGH 2018 (%) 22
FIGURE 10 Y-O-Y GROWTH IN DOLLAR AND UNIT SALES OF SN-PB FLIP CHIPS,
THROUGH 2018 (%) 27
FIGURE 11 Y-O-Y GROWTH IN DOLLAR AND VOLUME SALES OF LEAD-FREE FLIP
CHIPS, 2013-2018 (%) 33
FIGURE 12 Y-O-Y GROWTH IN DOLLAR AND VOLUME SALES OF GOLD STUD BUMPED
FLIP CHIPS, THROUGH 2018 (%) 36
FIGURE 13 MARKET SEGMENTATION BY APPLICATION 40
FIGURE 14 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGIES BY APPLICATION, 2012-
2018 ($ MILLIONS) 41
FIGURE 15 STRUCTURE OF MULTI-CHIP MODULE 43
FIGURE 16 STRUCTURE OF SYSTEM ON CHIP 43
FIGURE 17 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN MEMORY
APPLICATIONS, THROUGH 2018 ($ MILLIONS, %) 47
FIGURE 18 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN IMAGING
TECHNOLOGIES, 2012–2018 ($ MILLIONS, %) 50
FIGURE 19 STRUCTURE OF HB LED 50
FIGURE 20 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN HB-LED
APPLICATIONS, 2012–2018 ($ MILLIONS, %) 52
FIGURE 21 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN RF
APPLICATIONS, 2012–2018 ($ BILLIONS) 53
FIGURE 22 ARCHITECTURE OF 2.5D IC 54
FIGURE 23 STRUCTURE OF 3D IC 54
FIGURE 24 GLOBAL FLIP CHIP TECHNOLOGY MARKET BY END USE, 2012-2018 ($
MILLIONS) 58
FIGURE 25 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
SMARTPHONES, 2012-2018 ($ BILLIONS) 59
FIGURE 26 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
LAPTOPS, 2012–2018 ($ MILLIONS, %) 61
FIGURE 27 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
DESKTOP CPU, 2012–2018 ($ MILLIONS, %) 61
FIGURE 28 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN GPU
AND CHIPSET APPLICATIONS, 2012–2018 ($ MILLIONS, %) 62
FIGURE 29 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN OTHER
COMPUTING DEVICES, 2012–2018 ($ MILLIONS, %) 63
FIGURE 30 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
AUTOMOTIVE APPLICATIONS, 2012–2018 ($ MILLIONS, %) 64
FIGURE 31 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
ROBOTICS, 2012–2018 ($ MILLIONS, %) 66
FIGURE 32 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
MEDICAL DEVICES, 2012-2018 ($ MILLIONS, %) 66
FIGURE 33 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN SMART
TECHNOLOGIES, 2012–2018 ($ MILLIONS, %) 67
FIGURE 34 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN
INDUSTRIAL APPLICATIONS, 2012–2018 ($ MILLIONS, %) 68
FIGURE 35 GEOGRAPHICAL SEGMENTATION OF THE FLIP CHIP MARKET 71
FIGURE 36 INDUSTRY REVENUE MODEL 83
FIGURE 37 PORTER FIVE FORCES FOR FLIP CHIPS 86
FIGURE 38 REGIONAL ANALYSES OF PATENTS, 2010-2013* (NO. OF PATENTS PER
YEAR) 88
FIGURE 39 NUMBER OF PATENTS FILED BY YEAR, 2010-2013* 89
FIGURE 40 ADVANCED SEMICONDUCTOR ENGINEERING ANNUAL REVENUE,
2010-2012 ($ BILLIONS) 92
FIGURE 41 AMKOR TECHNOLOGY INC. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 93
FIGURE 42 GLOBAL FOUNDRIES U.S. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 95
FIGURE 43 IBM CORP. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 97
FIGURE 44 INTEL CORP. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 99
FIGURE 45 NEPES PTE LTD. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 100
FIGURE 46 POWERTECH TECHNOLOGY INC. ANNUAL REVENUE, 2010-2012 ($
BILLIONS) 102
FIGURE 47 SAMSUNG ELECTRONICS ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 104
FIGURE 48 SK HYNIX INC. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 106
FIGURE 49 STATS CHIPPAC LTD. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 107
FIGURE 50 STMICROELECTRONICS NV ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 109
FIGURE 51 TAIWAN SEMICONDUCTOR MANUFACTURING CO. ANNUAL REVENUE,
2010-2012 ($ BILLIONS) 111
FIGURE 52 TEXAS INSTRUMENTS ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 113

Read the full report:
Flip-Chip Technologies and Global Markets

https://www.reportbuyer.com/product/1941933/Flip-Chip-Technologies-and-Global-Markets.html

For more information:
Sarah Smith
Research Advisor at Reportbuyer.com
Email: [email protected]  
Tel: +44 208 816 85 48
Website: www.reportbuyer.com

SOURCE ReportBuyer

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today that SourceForge has been named “Media Sponsor” of SYS-CON's 21st International Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. SourceForge is the largest, most trusted destination for Open Source Software development, collaboration, discovery and download on the web serving over 32 million viewers, 150 million downloads and over 460,000 active development projects each and every month.
SYS-CON Events announced today that Nihon Micron will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Nihon Micron Co., Ltd. strives for technological innovation to establish high-density, high-precision processing technology for providing printed circuit board and metal mount RFID tags used for communication devices. For more inf...
Enterprises have taken advantage of IoT to achieve important revenue and cost advantages. What is less apparent is how incumbent enterprises operating at scale have, following success with IoT, built analytic, operations management and software development capabilities – ranging from autonomous vehicles to manageable robotics installations. They have embraced these capabilities as if they were Silicon Valley startups. As a result, many firms employ new business models that place enormous impor...
SYS-CON Events announced today that MIRAI Inc. will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MIRAI Inc. are IT consultants from the public sector whose mission is to solve social issues by technology and innovation and to create a meaningful future for people.
Widespread fragmentation is stalling the growth of the IIoT and making it difficult for partners to work together. The number of software platforms, apps, hardware and connectivity standards is creating paralysis among businesses that are afraid of being locked into a solution. EdgeX Foundry is unifying the community around a common IoT edge framework and an ecosystem of interoperable components.
SYS-CON Events announced today that Dasher Technologies will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Dasher Technologies, Inc. ® is a premier IT solution provider that delivers expert technical resources along with trusted account executives to architect and deliver complete IT solutions and services to help our clients execute their goals, plans and objectives. Since 1999, we'v...
SYS-CON Events announced today that TidalScale, a leading provider of systems and services, will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. TidalScale has been involved in shaping the computing landscape. They've designed, developed and deployed some of the most important and successful systems and services in the history of the computing industry - internet, Ethernet, operating s...
SYS-CON Events announced today that Massive Networks, that helps your business operate seamlessly with fast, reliable, and secure internet and network solutions, has been named "Exhibitor" of SYS-CON's 21st International Cloud Expo ®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. As a premier telecommunications provider, Massive Networks is headquartered out of Louisville, Colorado. With years of experience under their belt, their team of...
SYS-CON Events announced today that IBM has been named “Diamond Sponsor” of SYS-CON's 21st Cloud Expo, which will take place on October 31 through November 2nd 2017 at the Santa Clara Convention Center in Santa Clara, California.
Infoblox delivers Actionable Network Intelligence to enterprise, government, and service provider customers around the world. They are the industry leader in DNS, DHCP, and IP address management, the category known as DDI. We empower thousands of organizations to control and secure their networks from the core-enabling them to increase efficiency and visibility, improve customer service, and meet compliance requirements.
In his session at 21st Cloud Expo, Michael Burley, a Senior Business Development Executive in IT Services at NetApp, will describe how NetApp designed a three-year program of work to migrate 25PB of a major telco's enterprise data to a new STaaS platform, and then secured a long-term contract to manage and operate the platform. This significant program blended the best of NetApp’s solutions and services capabilities to enable this telco’s successful adoption of private cloud storage and launchi...
SYS-CON Events announced today that TidalScale will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. TidalScale is the leading provider of Software-Defined Servers that bring flexibility to modern data centers by right-sizing servers on the fly to fit any data set or workload. TidalScale’s award-winning inverse hypervisor technology combines multiple commodity servers (including their ass...
As hybrid cloud becomes the de-facto standard mode of operation for most enterprises, new challenges arise on how to efficiently and economically share data across environments. In his session at 21st Cloud Expo, Dr. Allon Cohen, VP of Product at Elastifile, will explore new techniques and best practices that help enterprise IT benefit from the advantages of hybrid cloud environments by enabling data availability for both legacy enterprise and cloud-native mission critical applications. By rev...
Join IBM November 1 at 21st Cloud Expo at the Santa Clara Convention Center in Santa Clara, CA, and learn how IBM Watson can bring cognitive services and AI to intelligent, unmanned systems. Cognitive analysis impacts today’s systems with unparalleled ability that were previously available only to manned, back-end operations. Thanks to cloud processing, IBM Watson can bring cognitive services and AI to intelligent, unmanned systems. Imagine a robot vacuum that becomes your personal assistant tha...
As popularity of the smart home is growing and continues to go mainstream, technological factors play a greater role. The IoT protocol houses the interoperability battery consumption, security, and configuration of a smart home device, and it can be difficult for companies to choose the right kind for their product. For both DIY and professionally installed smart homes, developers need to consider each of these elements for their product to be successful in the market and current smart homes.