Welcome!

News Feed Item

Research and Markets - Analysis of Apple's A10 iPhone 7 Plus Application Processor with a Technical Comparison with Apple's AP, the A9

DUBLIN, Dec 1, 2016 /PRNewswire/ --

Research and Markets has announced the addition of the "TSMC Integrated Fan-Out (inFO) Package Apple A10 iPhone 7 Plus Application Processor: Analysis" report to their offering.

Each year, Apple integrates new technology and innovation inside the iPhone. This year with the iPhone 7, Apple is the first to bring Package on Package (PoP) Wafer-Level Packaging (WLP) at the consumer scale. For its new application processor packaging, the A10, Apple has considered to use TSMC's new inFO-PoP (integrated Fan-Out PoP) technology.

Located under the DRAM package on the main board, the application processor (AP) is packaged using PoP. Depending on the version (iPhone 7 or iPhone 7 Plus), the DRAM memory has different space management.

The Apple A10 is a wafer-level package using TSMC's packaging technology with copper pillar as Through inFO Via (TIV) to replace the well-known Through Molded Via (TMV) technology. With this new technology, Apple marked a huge breaking point with the old traditional PoP found in the previous generations of his APs. In this report, we will show the differences and the innovations of this package: Copper Pillars, Redistribution layer, patent identification, silicon high density capacitor integration, The detailed comparison with the Exynos 8 and the Snapdragon 820 will give the pro and the cons of the inFO technology compared to PoP packaging used in the market.

Thanks to this inFO process, Apple is able to propose a very thin package on package, with a high number of I/O pads and better thermal management. The result is a very cost-effective component that can compete with any well-known PoP. In the report, the cost comparison is also including in order to highlight the difference.

This report also includes a technical comparison with previous Apple AP, the A9.

Key Topics Covered:

1. Overview / Introduction

2. Company Profile and Supply Chain

3. Physical Analysis
- Physical Analysis Methodology
- iPhone 7 Plus disassembly
- A10 Packaging Analysis
- Land-Side Decoupling capacitor
- PoP Comparison (Samsung's PoP and Shinko's MCeP)
- A10 Die Analysis
- Comparison with previous generation (A9)

4. Manufacturing Process Flow
- Chip Fabrication Unit
- Packaging Fabrication Unit
- inFO Package Process Flow

5. Cost Analysis
- Synthesis of the cost analysis
- Supply Chain Description
- Yield Hypotheses
- A10 Die Cost Analysis
- inFO Package Cost Analysis
- Final Test Cost
- Component Cost

6. Estimated Price Analysis

7. Cost & price comparison with Samsung's PoP & Shinko's MCeP

Companies Mentioned

- Apple
- GE
- HTC
- Huawei
- LG
- Samsung
- Xiaomi

For more information about this report visit http://www.researchandmarkets.com/research/nmb7st/tsmc_integrated

Media Contact:

Laura Wood, Senior Manager
[email protected]

For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

 



More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
SYS-CON Events announced today that Cloud Academy will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloud Academy is the industry’s most innovative, vendor-neutral cloud technology training platform. Cloud Academy provides continuous learning solutions for individuals and enterprise teams for Amazon Web Services, Microsoft Azure, Google Cloud Platform, and the most popular cloud computing technologies. Ge...
MongoDB Atlas leverages VPC peering for AWS, a service that allows multiple VPC networks to interact. This includes VPCs that belong to other AWS account holders. By performing cross account VPC peering, users ensure networks that host and communicate their data are secure. In his session at 20th Cloud Expo, Jay Gordon, a Developer Advocate at MongoDB, will explain how to properly architect your VPC using existing AWS tools and then peer with your MongoDB Atlas cluster. He'll discuss the secur...
SYS-CON Events announced today that CrowdReviews.com has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. CrowdReviews.com is a transparent online platform for determining which products and services are the best based on the opinion of the crowd. The crowd consists of Internet users that have experienced products and services first-hand and have an interest in letting other potential buyers...
Imagine having the ability to leverage all of your current technology and to be able to compose it into one resource pool. Now imagine, as your business grows, not having to deploy a complete new appliance to scale your infrastructure. Also imagine a true multi-cloud capability that allows live migration without any modification between cloud environments regardless of whether that cloud is your private cloud or your public AWS, Azure or Google instance. Now think of a world that is not locked i...
SYS-CON Events announced today that Infranics will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Since 2000, Infranics has developed SysMaster Suite, which is required for the stable and efficient management of ICT infrastructure. The ICT management solution developed and provided by Infranics continues to add intelligence to the ICT infrastructure through the IMC (Infra Management Cycle) based on mathemat...
In his session at Cloud Expo, Alan Winters, an entertainment executive/TV producer turned serial entrepreneur, will present a success story of an entrepreneur who has both suffered through and benefited from offshore development across multiple businesses: The smart choice, or how to select the right offshore development partner Warning signs, or how to minimize chances of making the wrong choice Collaboration, or how to establish the most effective work processes Budget control, or how to m...
SYS-CON Events announced today that Juniper Networks (NYSE: JNPR), an industry leader in automated, scalable and secure networks, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Juniper Networks challenges the status quo with products, solutions and services that transform the economics of networking. The company co-innovates with customers and partners to deliver automated, scalable and secure network...
SYS-CON Events announced today that Interoute, owner-operator of one of Europe's largest networks and a global cloud services platform, has been named “Bronze Sponsor” of SYS-CON's 20th Cloud Expo, which will take place on June 6-8, 2017 at the Javits Center in New York, New York. Interoute is the owner-operator of one of Europe's largest networks and a global cloud services platform which encompasses 12 data centers, 14 virtual data centers and 31 colocation centers, with connections to 195 add...
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
SYS-CON Events announced today that SD Times | BZ Media has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. BZ Media LLC is a high-tech media company that produces technical conferences and expositions, and publishes a magazine, newsletters and websites in the software development, SharePoint, mobile development and commercial UAV markets.
Historically, some banking activities such as trading have been relying heavily on analytics and cutting edge algorithmic tools. The coming of age of powerful data analytics solutions combined with the development of intelligent algorithms have created new opportunities for financial institutions. In his session at 20th Cloud Expo, Sebastien Meunier, Head of Digital for North America at Chappuis Halder & Co., will discuss how these tools can be leveraged to develop a lasting competitive advanta...
Building custom add-ons does not need to be limited to the ideas you see on a marketplace. In his session at 20th Cloud Expo, Sukhbir Dhillon, CEO and founder of Addteq, will go over some adventures they faced in developing integrations using Atlassian SDK and other technologies/platforms and how it has enabled development teams to experiment with newer paradigms like Serverless and newer features of Atlassian SDKs. In this presentation, you will be taken on a journey of Add-On and Integration ...
Now that the world has connected “things,” we need to build these devices as truly intelligent in order to create instantaneous and precise results. This means you have to do as much of the processing at the point of entry as you can: at the edge. The killer use cases for IoT are becoming manifest through AI engines on edge devices. An autonomous car has this dual edge/cloud analytics model, producing precise, real-time results. In his session at @ThingsExpo, John Crupi, Vice President and Eng...
There are 66 million network cameras capturing terabytes of data. How did factories in Japan improve physical security at the facilities and improve employee productivity? Edge Computing reduces possible kilobytes of data collected per second to only a few kilobytes of data transmitted to the public cloud every day. Data is aggregated and analyzed close to sensors so only intelligent results need to be transmitted to the cloud. Non-essential data is recycled to optimize storage.