Welcome!

News Feed Item

Research and Markets - Analysis of Apple's A10 iPhone 7 Plus Application Processor with a Technical Comparison with Apple's AP, the A9

DUBLIN, Dec 1, 2016 /PRNewswire/ --

Research and Markets has announced the addition of the "TSMC Integrated Fan-Out (inFO) Package Apple A10 iPhone 7 Plus Application Processor: Analysis" report to their offering.

Research and Markets Logo

Each year, Apple integrates new technology and innovation inside the iPhone. This year with the iPhone 7, Apple is the first to bring Package on Package (PoP) Wafer-Level Packaging (WLP) at the consumer scale. For its new application processor packaging, the A10, Apple has considered to use TSMC's new inFO-PoP (integrated Fan-Out PoP) technology.

Located under the DRAM package on the main board, the application processor (AP) is packaged using PoP. Depending on the version (iPhone 7 or iPhone 7 Plus), the DRAM memory has different space management.

The Apple A10 is a wafer-level package using TSMC's packaging technology with copper pillar as Through inFO Via (TIV) to replace the well-known Through Molded Via (TMV) technology. With this new technology, Apple marked a huge breaking point with the old traditional PoP found in the previous generations of his APs. In this report, we will show the differences and the innovations of this package: Copper Pillars, Redistribution layer, patent identification, silicon high density capacitor integration, The detailed comparison with the Exynos 8 and the Snapdragon 820 will give the pro and the cons of the inFO technology compared to PoP packaging used in the market.

Thanks to this inFO process, Apple is able to propose a very thin package on package, with a high number of I/O pads and better thermal management. The result is a very cost-effective component that can compete with any well-known PoP. In the report, the cost comparison is also including in order to highlight the difference.

This report also includes a technical comparison with previous Apple AP, the A9.

Key Topics Covered:

1. Overview / Introduction

2. Company Profile and Supply Chain

3. Physical Analysis
- Physical Analysis Methodology
- iPhone 7 Plus disassembly
- A10 Packaging Analysis
- Land-Side Decoupling capacitor
- PoP Comparison (Samsung's PoP and Shinko's MCeP)
- A10 Die Analysis
- Comparison with previous generation (A9)

4. Manufacturing Process Flow
- Chip Fabrication Unit
- Packaging Fabrication Unit
- inFO Package Process Flow

5. Cost Analysis
- Synthesis of the cost analysis
- Supply Chain Description
- Yield Hypotheses
- A10 Die Cost Analysis
- inFO Package Cost Analysis
- Final Test Cost
- Component Cost

6. Estimated Price Analysis

7. Cost & price comparison with Samsung's PoP & Shinko's MCeP

Companies Mentioned

- Apple
- GE
- HTC
- Huawei
- LG
- Samsung
- Xiaomi

For more information about this report visit http://www.researchandmarkets.com/research/nmb7st/tsmc_integrated

Media Contact:

Laura Wood, Senior Manager
[email protected]

For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

 



To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/research-and-markets---analysis-of-apples-a10-iphone-7-plus-application-processor-with-a-technical-comparison-with-apples-ap-the-a9-300371168.html

SOURCE Research and Markets

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
"We build IoT infrastructure products - when you have to integrate different devices, different systems and cloud you have to build an application to do that but we eliminate the need to build an application. Our products can integrate any device, any system, any cloud regardless of protocol," explained Peter Jung, Chief Product Officer at Pulzze Systems, in this SYS-CON.tv interview at @ThingsExpo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
"We are an all-flash array storage provider but our focus has been on VM-aware storage specifically for virtualized applications," stated Dhiraj Sehgal of Tintri in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
Internet of @ThingsExpo has announced today that Chris Matthieu has been named tech chair of Internet of @ThingsExpo 2017 New York The 7th Internet of @ThingsExpo will take place on June 6-8, 2017, at the Javits Center in New York City, New York. Chris Matthieu is the co-founder and CTO of Octoblu, a revolutionary real-time IoT platform recently acquired by Citrix. Octoblu connects things, systems, people and clouds to a global mesh network allowing users to automate and control design flo...
In addition to all the benefits, IoT is also bringing new kind of customer experience challenges - cars that unlock themselves, thermostats turning houses into saunas and baby video monitors broadcasting over the internet. This list can only increase because while IoT services should be intuitive and simple to use, the delivery ecosystem is a myriad of potential problems as IoT explodes complexity. So finding a performance issue is like finding the proverbial needle in the haystack.
Between 2005 and 2020, data volumes will grow by a factor of 300 – enough data to stack CDs from the earth to the moon 162 times. This has come to be known as the ‘big data’ phenomenon. Unfortunately, traditional approaches to handling, storing and analyzing data aren’t adequate at this scale: they’re too costly, slow and physically cumbersome to keep up. Fortunately, in response a new breed of technology has emerged that is cheaper, faster and more scalable. Yet, in meeting these new needs they...
Data is the fuel that drives the machine learning algorithmic engines and ultimately provides the business value. In his session at 20th Cloud Expo, Ed Featherston, director/senior enterprise architect at Collaborative Consulting, will discuss the key considerations around quality, volume, timeliness, and pedigree that must be dealt with in order to properly fuel that engine.
When it comes to cloud computing, the ability to turn massive amounts of compute cores on and off on demand sounds attractive to IT staff, who need to manage peaks and valleys in user activity. With cloud bursting, the majority of the data can stay on premises while tapping into compute from public cloud providers, reducing risk and minimizing need to move large files. In his session at 18th Cloud Expo, Scott Jeschonek, Director of Product Management at Avere Systems, discussed the IT and busin...
According to Forrester Research, every business will become either a digital predator or digital prey by 2020. To avoid demise, organizations must rapidly create new sources of value in their end-to-end customer experiences. True digital predators also must break down information and process silos and extend digital transformation initiatives to empower employees with the digital resources needed to win, serve, and retain customers.
The WebRTC Summit New York, to be held June 6-8, 2017, at the Javits Center in New York City, NY, announces that its Call for Papers is now open. Topics include all aspects of improving IT delivery by eliminating waste through automated business models leveraging cloud technologies. WebRTC Summit is co-located with 20th International Cloud Expo and @ThingsExpo. WebRTC is the future of browser-to-browser communications, and continues to make inroads into the traditional, difficult, plug-in web co...
In his general session at 19th Cloud Expo, Manish Dixit, VP of Product and Engineering at Dice, discussed how Dice leverages data insights and tools to help both tech professionals and recruiters better understand how skills relate to each other and which skills are in high demand using interactive visualizations and salary indicator tools to maximize earning potential. Manish Dixit is VP of Product and Engineering at Dice. As the leader of the Product, Engineering and Data Sciences team at D...
The Internet of Things (IoT) promises to simplify and streamline our lives by automating routine tasks that distract us from our goals. This promise is based on the ubiquitous deployment of smart, connected devices that link everything from industrial control systems to automobiles to refrigerators. Unfortunately, comparatively few of the devices currently deployed have been developed with an eye toward security, and as the DDoS attacks of late October 2016 have demonstrated, this oversight can ...
Get deep visibility into the performance of your databases and expert advice for performance optimization and tuning. You can't get application performance without database performance. Give everyone on the team a comprehensive view of how every aspect of the system affects performance across SQL database operations, host server and OS, virtualization resources and storage I/O. Quickly find bottlenecks and troubleshoot complex problems.
What happens when the different parts of a vehicle become smarter than the vehicle itself? As we move toward the era of smart everything, hundreds of entities in a vehicle that communicate with each other, the vehicle and external systems create a need for identity orchestration so that all entities work as a conglomerate. Much like an orchestra without a conductor, without the ability to secure, control, and connect the link between a vehicle’s head unit, devices, and systems and to manage the ...
"Once customers get a year into their IoT deployments, they start to realize that they may have been shortsighted in the ways they built out their deployment and the key thing I see a lot of people looking at is - how can I take equipment data, pull it back in an IoT solution and show it in a dashboard," stated Dave McCarthy, Director of Products at Bsquare Corporation, in this SYS-CON.tv interview at @ThingsExpo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
"We are the public cloud providers. We are currently providing 50% of the resources they need for doing e-commerce business in China and we are hosting about 60% of mobile gaming in China," explained Yi Zheng, CPO and VP of Engineering at CDS Global Cloud, in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.