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Future Opportunities for 3D Integrated Circuits: 3D Stacked Memory and 3D MEMS Driving Opportunities in Consumer Electronics and Communication Markets - Research and Markets

Research and Markets has announced the addition of the "Future Opportunities for 3D Integrated Circuits" report to their offering.

A notable feature of the 3D IC market ecosystem is that the vendor side of the supply chain is highly fragmented. This is mainly because of the numerous options available for 3D Integration. Also, the business models adopted by 3D IC fabrication companies are constantly evolving. The core technology is constantly being updated to the next-generation technology, foundries transitioning to end-to-end product developers, fabless designers venturing into software-based 3D designing and so on.

This technology and innovation report highlights through silicon vias (TSV) as the key technology in 3D IC technology. The report discusses the market and technological drivers and restraints for the 3D IC market and identifies the various technologies enabling 3D integration. TSV interconnect technology is analyzed exhaustively by evaluating key participants and their strategies in the TSV-enabled 3D integration sector.

Key Topics Covered:

1. Executive Summary

1.1 Research Scope

1.2 Research Methodology

1.3 Research Methodology Explained

1.4 3D Integration Technology Categorization

1.5 Key Findings - Significance, R&amp

1.6 Key Findings - Global Challenges and Scenario, Industry Initiatives

2. Technological and Market Landscape

2.1 Three-dimensional Integrated Circuits - An Introduction

2.2 High Bargaining Power of Suppliers and Threat of New Entrants Impacting Attractiveness of 3D IC Industry

2.3 Continuing Demand for Smartphones and Expected Increase in Cost Currently Driving Opportunities in 3D ICs

2.4 Key Drivers Explained

2.5 High Cost and Technological and Process Challenges Currently Limiting Opportunities for 3D ICs

2.6 Key Market Restraints Explained

2.7 Technological Drivers and Challenges

2.8 Technological Drivers

2.9 Technological Challenges

3. Technology Snapshot of 3D Integrated Circuits

3.1 3D IC Packaging Techniques Enable Vertical Integration

3.2 3D Monolithic Integration

3.3 3D Integration - Die Singulation

3.4 3D Integration - Stacking Orientation

3.5 3D Integration - Bonding Technique

3.6 3D Integration - Through Silicon Vias

3.7 3D Integration - Wafer Type

4. Patent and Funding Analysis

4.1 APAC and NA Actively Focusing on R&amp

4.2 Research on Through Silicon Via is Actively Pursued Across the Globe

4.3 Pursuit of Technological and Market Leadership Outlines Funding Trends

5. 3D Integration with TSV Interconnect Technology

5.1 Introduction to TSV Technology

5.2 3D IC Enabled with TSV is the Next Frontier in 3D Integration Technology

5.3 Interconnect Drilling, Wafer Thinning and Stacking form Core TSV Interconnect Process Technology

5.4 Key Innovation Profile - Allvia Inc.

5.5 Key Innovation Profile - Amkor Technologies

5.6 Key Innovation Profile - Novati Technologies

5.7 Key Innovation Profile - Aveni

5.8 Key Innovation Profile - STATS ChipPAC

5.9 Key Players in 3D IC Industry

6. 3D IC Product and Application Landscape

6.1 Memory, Microelectromechanical Systems, and Image Sensors are Key Products Enabled with 3D IC

6.2 Consumer Electronics, ICT, and Aerospace are Major Application Areas of 3D IC

6.3 Product - Application Impact Matrix

6.4 Impact of Products on Application Areas Explained

7. Strategic Insights on 3D IC Industry

7.1 Integrated Technology Roadmap

7.2 Integrated Technology Roadmap Explained - 3D Integration Enabled Products Driving Futuristic Innovations in Major industries

7.3 Growth Opportunities

7.4 Key Questions for Strategic Planning

8. Key Patents

9. Key Industry Contacts

For more information about this report visit http://www.researchandmarkets.com/research/d2jqlt/future

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