Welcome!

News Feed Item

Interposer and Fan-Out WLP Market Worth 13.42 Billion USD by 2022

PUNE, India, April 20, 2017 /PRNewswire/ --

According to the new research report "Interposer and Fan-Out WLP Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (TSV, Interposer, and Fan-Out WLP), End-User Industry, and Region - Global Forecast to 2022", published by MarketsandMarkets™, the market is expected to be valued at USD 13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and 2022.

     (Logo: http://photos.prnewswire.com/prnh/20160303/792302 )

Browse 25 market data Tables and 42 Figures spread through 172 Pages and in-depth TOC on "Interposer and Fan-Out WLP Market"

http://www.marketsandmarkets.com/Market-Reports/interposer-fan-out-wlp-market-130599842.html

Early buyers will receive 10% customization on this report. 

The growth of this market is mainly driven by the rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of advanced wafer level packaging technologies in MEMS and sensors.

Through-silicon Vias (TSVs) held the largest size of the interposer and fan-out WLP market in 2015 

TSV is one of the most compact package types with increased functionality. TSV has gained popularity in space-constrained mobile applications and is used in portable consumer devices as well as industrial products as it is a cost-effective, compact, lightweight, and high-performing semiconductor. The rising demand for advanced memory packages such as flash and hybrid memory, image sensors, and others in the consumer electronics industry is driving the growth of this market.

The market for memory applications to grow at the highest rate between 2016 and 2022 

The use of interposer and fan-out WLP is expected to provide a cost-effective solution and drive the wide-scale adoption of this technology in potential end products. The average number of stacked dice in memory modules is likely to grow with the increasing usage of interposers. Moreover, innovations in advanced data storage such as flash memory, hybrid memory cube, and so on are creating a demand for interposer and fan-out WLP to develop high-performing compact memory solutions. In addition, the advent of complex device designs has brought new challenges in interconnections such as need for higher I/O density and performance requirements, which are efficiently addressed by interposer and fan-out WLP.

APAC accounted for the largest share of the interposer and fan-out WLP market in 2015 

The major factors driving the growth of the market in APAC include the presence of major semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan); proximity to major downstream electronics manufacturing operations; government-sponsored infrastructure support; tax incentives; and availability of skilled engineers and labor at a relatively low cost.

Download PDF Brochure @ http://www.marketsandmarkets.com/pdfdownload.asp?id=130599842

The major players operating in the interposer and fan-out WLP market include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), ASE Group (Taiwan), Amkor Technology (U.S.), Qualcomm Incorporated (U.S.), Texas Instruments (U.S.), United Microelectronics Corp. (Taiwan), STMicroelectronics NV (Switzerland), Broadcom Ltd. (Singapore), Intel Corporation. (U.S.), Jiangsu Changing Electronics Technology Co., Ltd. (China), and Infineon Technologies AG (Germany).

Browse Related Reports 

Silicon on Insulator Market by Wafer Size (200 mm, 300 mm), Wafer Type (RFSOI, FDSOI), Technology (BESOI, ELTRAN, SoS, SiMOX, Smart Cut), Product, Application (Automotive, Computing & Mobile, Entertainment & Gaming, Photonics) - Global Forecast to 2022

http://www.marketsandmarkets.com/Market-Reports/global-silicon-on-insulator-market-158.html

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022

http://www.marketsandmarkets.com/Market-Reports/flip-chip-technology-market-264572064.html

About MarketsandMarkets™ 

MarketsandMarkets™ provides quantified B2B research on 30,000 high growth niche opportunities/threats which will impact 70% to 80% of worldwide companies' revenues. Currently servicing 5000 customers worldwide including 80% of global Fortune 1000 companies as clients. Almost 75,000 top officers across eight industries worldwide approach MarketsandMarkets™ for their painpoints around revenues decisions.

Our 850 fulltime analyst and SMEs at MarketsandMarkets™ are tracking global high growth markets following the "Growth Engagement Model - GEM". The GEM aims at proactive collaboration with the clients to identify new opportunities, identify most important customers, write "Attack, avoid and defend" strategies, identify sources of incremental revenues for both the company and its competitors. MarketsandMarkets™ now coming up with 1,500 MicroQuadrants (Positioning top players across leaders, emerging companies, innovators, strategic players) annually in high growth emerging segments. MarketsandMarkets™ is determined to benefit more than 10,000 companies this year for their revenue planning and help them take their innovations/disruptions early to the market by providing them research ahead of the curve.

MarketsandMarkets' flagship competitive intelligence and market research platform, "RT" connects over 200,000 markets and entire value chains for deeper understanding of the unmet insights along with market sizing and forecasts of niche markets.

Subscribe Reports from Semiconductor Domain @ http://www.marketsandmarkets.com/Knowledgestore.asp

Contact:
Mr. Rohan
MarketsandMarkets™
701 Pike Street
Suite 2175, Seattle,
WA 98101, United States
Tel : +1-888-600-6441
Email: [email protected]

Visit our Blog@ http://www.marketsandmarketsblog.com/market-reports/electronics-and-semiconductors  
Connect with us on LinkedIn @ http://www.linkedin.com/company/marketsandmarkets


SOURCE MarketsandMarkets

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
While the focus and objectives of IoT initiatives are many and diverse, they all share a few common attributes, and one of those is the network. Commonly, that network includes the Internet, over which there isn't any real control for performance and availability. Or is there? The current state of the art for Big Data analytics, as applied to network telemetry, offers new opportunities for improving and assuring operational integrity. In his session at @ThingsExpo, Jim Frey, Vice President of S...
"We focus on SAP workloads because they are among the most powerful but somewhat challenging workloads out there to take into public cloud," explained Swen Conrad, CEO of Ocean9, Inc., in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
"As we've gone out into the public cloud we've seen that over time we may have lost a few things - we've lost control, we've given up cost to a certain extent, and then security, flexibility," explained Steve Conner, VP of Sales at Cloudistics,in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
"We provide IoT solutions. We provide the most compatible solutions for many applications. Our solutions are industry agnostic and also protocol agnostic," explained Richard Han, Head of Sales and Marketing and Engineering at Systena America, in this SYS-CON.tv interview at @ThingsExpo, held June 6-8, 2017, at the Javits Center in New York City, NY.
"We are focused on SAP running in the clouds, to make this super easy because we believe in the tremendous value of those powerful worlds - SAP and the cloud," explained Frank Stienhans, CTO of Ocean9, Inc., in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
DX World EXPO, LLC., a Lighthouse Point, Florida-based startup trade show producer and the creator of "DXWorldEXPO® - Digital Transformation Conference & Expo" has announced its executive management team. The team is headed by Levent Selamoglu, who has been named CEO. "Now is the time for a truly global DX event, to bring together the leading minds from the technology world in a conversation about Digital Transformation," he said in making the announcement.
"DX encompasses the continuing technology revolution, and is addressing society's most important issues throughout the entire $78 trillion 21st-century global economy," said Roger Strukhoff, Conference Chair. "DX World Expo has organized these issues along 10 tracks with more than 150 of the world's top speakers coming to Istanbul to help change the world."
"Peak 10 is a hybrid infrastructure provider across the nation. We are in the thick of things when it comes to hybrid IT," explained , Chief Technology Officer at Peak 10, in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
"I think DevOps is now a rambunctious teenager – it’s starting to get a mind of its own, wanting to get its own things but it still needs some adult supervision," explained Thomas Hooker, VP of marketing at CollabNet, in this SYS-CON.tv interview at DevOps Summit at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
"We are still a relatively small software house and we are focusing on certain industries like FinTech, med tech, energy and utilities. We help our customers with their digital transformation," noted Piotr Stawinski, Founder and CEO of EARP Integration, in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
"We've been engaging with a lot of customers including Panasonic, we've been involved with Cisco and now we're working with the U.S. government - the Department of Homeland Security," explained Peter Jung, Chief Product Officer at Pulzze Systems, in this SYS-CON.tv interview at @ThingsExpo, held June 6-8, 2017, at the Javits Center in New York City, NY.
"We're here to tell the world about our cloud-scale infrastructure that we have at Juniper combined with the world-class security that we put into the cloud," explained Lisa Guess, VP of Systems Engineering at Juniper Networks, in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
"I will be talking about ChatOps and ChatOps as a way to solve some problems in the DevOps space," explained Himanshu Chhetri, CTO of Addteq, in this SYS-CON.tv interview at @DevOpsSummit at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
Your homes and cars can be automated and self-serviced. Why can't your storage? From simply asking questions to analyze and troubleshoot your infrastructure, to provisioning storage with snapshots, recovery and replication, your wildest sci-fi dream has come true. In his session at @DevOpsSummit at 20th Cloud Expo, Dan Florea, Director of Product Management at Tintri, provided a ChatOps demo where you can talk to your storage and manage it from anywhere, through Slack and similar services with...
The financial services market is one of the most data-driven industries in the world, yet it’s bogged down by legacy CPU technologies that simply can’t keep up with the task of querying and visualizing billions of records. In his session at 20th Cloud Expo, Karthik Lalithraj, a Principal Solutions Architect at Kinetica, discussed how the advent of advanced in-database analytics on the GPU makes it possible to run sophisticated data science workloads on the same database that is housing the rich...