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Rambus Partners With Samsung to Develop 56G SerDes PHY on 10nm LPP Process

Rambus Inc. (NASDAQ:RMBS) today announced that it is partnering with Samsung Electronics for its recently launched 56G SerDes PHY to be developed on Samsung’s 10nm LPP (Low-Power Plus) process technology.

The industry-leading 56G SerDes PHY delivers enterprise-class performance across the challenging signaling environments typical of high-speed communication systems and provides PAM-4 and NRZ signaling with a scalable ADC-based (analog-to-digital converter) architecture. This new, flexible architecture addresses the long-reach backplane requirements for the industry transition to 400 GB Ethernet applications.

“There is a demand for increased bandwidth and higher performance systems with the rise of data across enterprise applications,” said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces Division. “Our partnership with Samsung enables us to bring more solutions quickly to market that address the process, power and performance challenges of today’s complex data centers. We are pleased Samsung has selected to work with us, following our successful partnership of the 28G SerDes PHY on their 14nm LPP process technology.”

“Network application is one of our key segments of focus and the composition of our 10LPP network solution and the Rambus 56G solution will be the most competitive choice for high-performance and low-power consumption,” said Ryan Lee, vice president of the Foundry Marketing Team at Samsung Electronics. “Rambus has been a long-term strategic partner with Samsung for high-speed SerDes IP, and this 56G SerDes collaboration will pave the way for the explosive data processing requirements to come.”

The Rambus industry-standard interface offerings are high-quality, complete PHY solutions designed with a system-oriented approach to maximize flexibility in today’s most challenging system environments. For additional information, please visit http://www.rambus.com/serdes.

For additional information on Rambus products and solutions, please visit rambus.com.

Follow Rambus:

Company website: rambus.com

Rambus blog: rambus.com/blog

Twitter: @rambusinc

LinkedIn: www.linkedin.com/company/rambus

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About Rambus Memory and Interfaces Division

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.

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