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Global Electronics Components Plastics Technologies and Markets 2016-2022

DUBLIN, October 13, 2017 /PRNewswire/ --

The "Plastics in Electronics Components: Technologies and Global Markets" report has been added to Research and Markets' offering.

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Report Includes

  • An overview of the global market for plastics in electronic components
  • Analyses of global market trends, with data from 2016, estimates for 2017, and projections of compound annual growth rates (CAGRs) through 2022
  • Information about pricing of resins, molders of electronic components, testing agencies, and requirements related to electronic components
  • Coverage of single devices, such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
  • Comprehensive company profiles of major players in the industry

This study covers all electronics components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures.

The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronics components, and it looks at interpolymer competition.

Key Topics Covered:

1: Introduction

  • Study Goals and Objectives
  • Reasons for Doing This Study
  • Scope of Report
  • Information Sources
  • Methodology
  • Geographic Breakdown

2: Summary and Highlights

3: Market and Technology Background

  • Overview
  • Snapshot of the Electronics Device Market
  • Computers
  • Electronics Displays
  • Printers
  • "All-in-One" Machines
  • Phones
  • Fax Machines
  • Scanners
  • Mobile Electronics Devices
  • Automotive Market

4: Market Breakdown by Technology Type

  • Overview
  • Types of Polymers
  • Thermoplastics
  • Thermoset Polymers

5: Overview of Key Components, PCBs and Encapsulants

  • Introduction
  • Focus of This Report
  • Resin Consumption
  • Printed Circuit Boards
  • Encapsulants

6: Molded Electronics Products

  • Overview
  • Connectors
  • Switches
  • Coil Formers
  • Relays
  • Capacitors
  • Other Molded Electronics Components
  • Summary of Market Estimates and Forecasts

7: Patent Review/ New Developments

  • Background
  • Importance of Miniaturization
  • Thin-Walling Electronics Components
  • Flexible Electronics
  • Wearable Electronics
  • Cloud Computing and Big Data
  • The Internet of Everything
  • Changes in Electronics Component Manufacturing that Could Influence Resin Choices
  • Recent Patents Related to the Industry

8: Electronics Components Industry Overview and Plastics Producers

  • Top Semiconductor Producers and Customers
  • Manufacturing and Marketing Aspects
  • Plastics Producers
  • Polymer Producers According to Material Type

9: Environmental Issues

  • Overview
  • Printed Circuit Board Disposal
  • Bromine-Free Printed Circuit Boards
  • Halogen-Free Flame Retardants for Thermoplastics
  • Recycling
  • Electronics Industry Interface

10: Performance Requirements Related to Electronics Components

  • Overview
  • Flammability Standards
  • Flammability Tests
  • Other Standards

11: Company Profiles

  • Asahi Kasei Chemical
  • Ashland Inc.
  • Basf
  • Celanese
  • Covestro AG
  • Cytec Industries Inc.
  • DSM
  • E.I. Dupont De Nemours And Company
  • Ems Grivory
  • Epic Resins
  • Henkel AG
  • Huntsman Advanced Materials
  • Interplastic Corp.
  • Kingfa
  • Lanxess AG
  • Mitsubishi Engineering Plastics
  • Polyplastics
  • Sabic Innovative Plastics
  • Solvay Specialty Polymers
  • Sumitomo Bakelite
  • Toray Plastics
  • Victrex

12: Appendix: Acronyms

For more information about this report visit https://www.researchandmarkets.com/research/9zcgds/plastics_in

Media Contact:

Research and Markets
Laura Wood, Senior Manager
[email protected]

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